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Heat sink - Company Ranking(45 companies in total)

Last Updated: Aggregation Period:Aug 19, 2026〜Sep 15, 2026
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
【Features】 * Height variations: Options available to match housing space, such as 6mm/10mm/13mm. * Compatible with automatic mounting: Impro... 【Example of Compatible Packages】 TO Series: D PAK (TO 252), D2 PAK (TO 263), D3 PAK (TO 268) SOT Series: SOT 223, SOT 669 (LF PAK) SO Ser...
Model number: SK159 Product type: Heat sink for forced air cooling Width: 400mm Height: 83.5mm Length: 200 / 300 / 400 / 500 / 600 m... Cooling of IGBT modules Heat dissipation measures for inverter equipment Thermal measures for power supply units Servo drive and motor...
Please refer to our company website. Heat dissipation of TO-220 package semiconductors
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  1. Featured Products
    SMT-compatible heat sink for DPAK | Achieving space-saving heat dissipation on the circuit boardSMT-compatible heat sink for DPAK | Achieving space-saving heat dissipation on the circuit board
    overview
    【Features】 * Height variations: Options available to match housing space, such as 6mm/10mm/13mm. * Compatible with automatic mounting: Impro...
    Application/Performance example
    【Example of Compatible Packages】 TO Series: D PAK (TO 252), D2 PAK (TO 263), D3 PAK (TO 268) SOT Series: SOT 223, SOT 669 (LF PAK) SO Ser...
    Large heat sink 400mm wide SK159 forced air coolingLarge heat sink 400mm wide SK159 forced air cooling
    overview
    Model number: SK159 Product type: Heat sink for forced air cooling Width: 400mm Height: 83.5mm Length: 200 / 300 / 400 / 500 / 600 m...
    Application/Performance example
    Cooling of IGBT modules Heat dissipation measures for inverter equipment Thermal measures for power supply units Servo drive and motor...
    Heat sink for TO-220 package semiconductors Al99.5Heat sink for TO-220 package semiconductors Al99.5
    overview
    Please refer to our company website.
    Application/Performance example
    Heat dissipation of TO-220 package semiconductors